Conference special issues

Metamaterials for Novel Wave Phenomena: Theory, Design and Application in Microwaves, Optics, and Mechanics

Starting from the 2015 edition of the Metamaterials conference, a partnership between the journal EPJ Applied Metamaterials and the Metamaterials Congress has been established, which envisage a Special Issue of the Congress published on EPJ AM every year.

The aim of the Metamaterials'2023 congress special issue is to provide a representative collection of recent developments in microwave, optical, photonic, and mechanical metamaterials. Particularly, the special issue offers the possibility to publish in extended format the best contributions submitted and presented at Metamaterials’2023.

We therefore invite the authors of abstracts whose topic falls in the above categories to submit an extended version of their work to EPJ AM. 

As for the previous editions (free access here: 2015, 2016, 20172018, 2020, 2021), also the 2023 edition of the Special Issue will contain a selection of invited, regular and review articles submitted and accepted to Metamaterials 2023 conference. 

EPJ AM is an open access platform for multidisciplinary researchers to exchange information on metamaterials with a focus on high impact engineering applications. The journal is indexed in Scopus, Emerging Sources Citation Index (Web of Science), Engineering Village-EI Compendex databases, and DOAJ (Directory of Open Access Journals).

Submissions are now open. When submitting your manuscript on the EPJ AM submission home page, please, under “General Information” –> “Section/Category” select the Topical Issue Special Issue - Metamaterials for Novel Wave Phenomena: Theory, Design and Application in Microwaves, Optics, and Mechanics"

The Special Issue is expected to be published before the end of 2023. Please note that the journal has no mandatory publication fees and adopts a "Pay what you want model".

Click here for more information.

Guest Editors
Sander Mann, 
CUNY Advanced Science Research Center, US
Stefano Vellucci, Niccolò Cusano University, Italy

Deadline
September 30, 2023

 
 
 
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